FOR IMMEDIATE RELEASE
FOPLP
Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration
AQWOL-5S
offers optional W-AIMS machine learning monitoring
NEW TAIPEI CITY, Taiwan –
August
18th,
2026
– Taiwanese thermal processing equipment maker WEISUN
Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to
its AQWOL-5S Smart Clean Room and Inert Gas Oven, aimed at OSAT and
substrate makers running fan-out panel level packaging (FOPLP) lines.
The chamber is sized to a single panel format, against the standard
chamber built for panels up to 700 x 700mm.
Warpage and alignment error scale with panel area. They are introduced
during cure and anneal. Oven performance therefore bears directly on
panel level packaging yield.
Chamber
Sized to One Panel Format
The 310mm configuration holds 25 panels per cassette in a chamber sized
for the format. Process controls are the same as the standard version.
Airflow is regulated through an 8-zone automatic damper system, against
the 28 zones the larger chamber requires across its working area.
Temperature uniformity is specified at ±3°C. A smaller working volume
means less gas to purge and less thermal mass to hold stable.
Sub-50ppm
Oxygen for PI BCB and PBO Cure
The oven runs from room temperature to 200°C in a Class 100 clean
environment, holding in-chamber oxygen below 50ppm to prevent substrate
oxidation during thermal processing. The standard configuration holds
temperature uniformity within ±1.5 percent. Cooling is available as air
cooling with N2 or CDA, or water cooling, with a rapid air-cooling
system available as an option.
The standard configuration accepts steel carriers up to 700 x 700mm at
4mm thickness and 15kg per sheet. Glass panel sizes run from 310 x
310mm on the 25-slot cassette up to 700 x 700mm on a 12-layer carrying
rack.
W-AIMS
Machine Learning Monitoring
The oven can be supplied with W-AIMS, WEISUN’s own control and
monitoring software, which evaluates the condition of the airflow
system across HEPA filter pressure differential, chamber airtightness,
damper zone behavior and ventilation efficiency, and returns
maintenance recommendations ranked by severity against configurable
limits. Evaluation uses machine learning models trained before shipment
and then adapted to the customer’s actual process parameters on site.
These four subsystems govern the oxygen concentration, cleanliness
class and temperature uniformity the oven is specified against.
SEMI
E187 Cybersecurity Verified
WEISUN completed SEMI E187 compliance verification for fab equipment,
the semiconductor industry’s cybersecurity specification, at the end of
2024. The company holds both ISO 9001 and ISO 27001 certification and
develops and manufactures in Taiwan, which accounts for the largest
share of global advanced packaging substrate production capacity.
SECS/GEM
and CIM Integration
The oven communicates over CIM, Ethernet and SECS/GEM, and PCB ECI, and
supports manual loading as well as automated handling through AMR-robot
or conveyor-robot configurations. Production status, temperature and
oxygen concentration are available remotely, with logging for process
history and traceability.
Automation
Taipei Booth L426
WEISUN will show both configurations at Automation Taipei, August 19 to
22, 2026, at Nangang Exhibition Hall 1.
Built
to Order
The AQWOL-5S is made to order in either configuration. WEISUN sells
directly and through appointed distributors, with existing coverage in
China and Southeast Asia. Specifications and sales inquiries: https://www.wei-sun-oven.com/product_d.php?lang=en&tb=2&id=992
About
WEISUN Industrial Co., Ltd.
WEISUN Industrial Co., Ltd. is a Taiwan-based manufacturer of
industrial drying and thermal processing equipment headquartered in New
Taipei City. Founded in 1976 as a contract manufacturer for other
drying equipment makers, the company launched its own WEISUN brand in
2009 and has since transitioned to a fully self-branded, Taiwan-made
model. WEISUN serves the semiconductor, PCB, flat panel and LED
industries. Customers include Intel, Micron, GlobalFoundries, ASE and
Unimicron. https://www.wei-sun-oven.com